无卤PI覆铜箔基材 Halogen-Free Polyimide Film Based FCCL

产品特点:
优异的耐高温高湿性能
良好的尺寸安定性、挠曲性及耐离子迁移
优良的电性能,化学性能及耐热性能
不含卤素, 阻燃性能达到UL94 VTM-0
本产品符合IPC规范

Feature:
Excellent high humidity and temperature resistance
Excellent dimensional stability,High flexibility and
Excellent Migration ability
Excellent electrical ,chemical and thermal property
Halogen free and Flame retardancy UL 94VTM-0
Meet with IPC standards

产品特性(FCCL Characteristic):
特性
property
单位
Unit
条件
Condition
标准
Standard
AFES131218 AFES131212 AFES252018 测试方法
Test method
PI Film
Adhesive
Copper Foil
Peel Strength Kgf/cm
(90)
normal H mil≧0.8
1 mil≧1.0
1.3~1.5 1.1~1.3 1.3~1.7 IPC-TM-650 2.4.9
Dimension Stability TD % Method B ≦±0.15 0.05~0.10 0.04~0.09 0.06~0.10 IPC-TM-650 2.2.4
MD % -0.07~0.04 -0.05~-0.08 -0.06~0.05
Solder Float Resistance --- 300℃/10sec No Change Appearance Pass Pass Pass IPC-TM-650 2.4.13
Chemical Resistance % NaOH ≦20 1~7 1~7 1~7 IPC-TM-650 2.3.2
% HCI 1~8 1~8 1~8
% IPA 1~7 1~7 1~7
Moisture Absorption % D-24/23 ≦2.0 0.9~1.2 1.0~1.3 1.0~1.3 IPC-TM-650 2.6.2
Volume Resistance Ω-cm C-96/23/65 ≧1012 ≧1014 ≧1014 ≧1014 IPC-TM-650 2.5.17
Surface Resistance Ω C-96/23/65 ≧1010 ≧1012 ≧1012 ≧1012
Insulation resistance Ω C-96/23/65 ≧109 ≧109 ≧109 ≧109 IPC-TM-650 2.6.3.2
Dielectric constant 10MHZ --- C-48/40/90 ≦4.0 3.4~3.6 IPC-TM-650 2.5.5.3
Dissipation factor 10MHZ --- C-48/40/90 ≦0.04 0.032~0.036
Note:1. Data shown above are nominal values for reference only,Details see Certification of Quality
  2. Storage Condition:Vacuum Packaging: Below 30℃ for 1year,
Normal Packaging : Below 30℃,below 70% RH for 1year